Synergistic Application of XPS and TOF-SIMS for Accurate TraceElement Analysis in Electronic and Automotive Materials
DOI:
https://doi.org/10.47363/JMSMR/2026(7)221Keywords:
Failure Analysis, XPS, TOF-SIMS, Trace Elements, Selenium, Boron, Phosphorus, LED Lead Frame, Automotive Cleaning Process, Surface CharacterizationAbstract
This paper presents a comprehensive study on the combined application of X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ionmass spectrometry (TOF-SIMS) for the identification and quantification of trace elements in surface analysis. Two detailed case studies are examined:
• The detection and quantification of selenium (Se) on LED lead frames, and
• The analysis of boron (B) and phosphorus (P) residues on automotive aluminum components after surface cleaning.
XPS provides reliable quantitative data and chemical state information, but is limited by spectral interferences and a detection limit of approximately 0.1–1.0 at%. TOF-SIMS offers superior sensitivity (ppm level) and mass specificity, but lacks inherent quantitative capability without standards. By integrating TOF-SIMS for qualitative confirmation prior to XPS quantification, we overcome the limitations of each technique, avoid analytical misjudgements, and obtain accurate quantitative results. This synergistic approach enhances analytical confidence and is applicable to surface contamination studies in microelectronics, automotive, and related high-value manufacturing industries.